发明名称 HEAT-INSULATING PANEL, WALL PANEL AND OUTER-WALL STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat-insulating panel capable of preventing the retention of moisture in the panel and having a heat-insulating property. SOLUTION: The heat-insulating panel is formed by mounting a frame structure 4 formed by fitting boards 2 and 3 on both surfaces of a frame material 1, respectively, and a heat-insulating material 5 disposed inside the frame structure 4. A kenaf-fiber board 6 having a thickness of 1 to 4 mm and molded by bonding an aggregate composed of kenaf fibers obtained by yarn-splitting a kenaf by a thermosetting resin is used as at least one board 2 in the boards 2 and 3 on both surfaces of the frame material 1. The kenaf fibers have fiber lengths of 10 to 200 mm and fiber diameters of 10 to 300μm. Even if the moisture infiltrates into the frame structure 4 by dew condensation or the like. the moisture is permeated as damp and can be discharged by the high moisture permeability of the kenaf-fiber board 6, and the retention of the moisture in the panel can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006328828(A) 申请公布日期 2006.12.07
申请号 JP20050154683 申请日期 2005.05.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 UMEOKA KAZUAKI;NAITO SHIGEKI;OKUDAIRA YUZO
分类号 E04B1/80;E04B2/56 主分类号 E04B1/80
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