发明名称 THERMOSETTING RESIN COMPOSITION, ITS MOLDING METHOD AND MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has highly good storage stability, can sufficiently ensure good flowability in molds, also when thermally set at 110 to 130°C, and can largely shorten a time arriving at perfect setting to respond to high cycle molding, and to provide a molded article obtained by setting the thermosetting resin composition. SOLUTION: This thermosetting resin composition comprising an unsaturated polyester resin or vinyl ester resin, a radically reactive monomer, a high temperature-active peroxide having a 10 hour half-life temperature of 60 to 80°C, a low temperature-active peroxide having a 10 hour half-life temperature of 40 to 50°C, and a specific rate of hydroquinone is characterized in that the hydroquinone is preliminarily dissolved in a mixture solution of the radically reactive monomer with a lower alcohol. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006328211(A) 申请公布日期 2006.12.07
申请号 JP20050153360 申请日期 2005.05.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HIRABAYASHI TATSUO;NAGAOKA ATSUSHI
分类号 C08F283/01;C08F4/38;C08F290/06 主分类号 C08F283/01
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