发明名称 |
Method for manufacturing metal microstructure |
摘要 |
A method of manufacturing a metal microstructure ( 1 ) by using a resin mold ( 13 ). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold ( 13 ) can be set and the high-precision metal microstructure ( 1 ) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure ( 1 ) according to the present invention includes the steps of: fixing on a conductive substrate ( 11 ) the resin mold ( 13 ) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer ( 12 ) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure ( 2 ) having the resin mold ( 13 ); exposing the layered structure ( 2 ) having the resin mold ( 13 ) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer ( 12 c) existing at the vacant portion of the resin mold ( 13 ); and filling with a metal ( 14 ) the vacant portion of the layered structure ( 2 ) having the resin mold ( 13 ) by electroforming.
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申请公布号 |
US2006276044(A1) |
申请公布日期 |
2006.12.07 |
申请号 |
US20060503303 |
申请日期 |
2006.08.14 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YORITA JUN;HIRATA YOSHIHIRO;HAGA TSUYOSHI |
分类号 |
G03C5/00;B81C1/00;C25D1/00;H01L21/302;H01L21/48;H05K3/20 |
主分类号 |
G03C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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