发明名称 Method of fabricating light-emitting semiconductor device
摘要 A light-emitting diode having a silicon substrate on which there are successively formed a buffer layer, a p-type nitride semiconductor layer, an active layer, an n-type nitride semiconductor layer, and a current spreading layer. The current spreading layer is a lamination of a first and a second sublayer arranged alternately a required number of times. Composed of different compound semiconductors, the alternating sublayers of the current spreading layer create heterojunctions for offering the two-dimensional gas effect. The current spreading layer is so low in resistivity in a direction parallel to its major surface from which light is emitted, that the current is favorably spread therein for improved efficiency of light emission. A front electrode in the form of a metal pad is mounted centrally on the major surface of the current spreading layer in ohmic contact therewith.
申请公布号 US2006275937(A1) 申请公布日期 2006.12.07
申请号 US20060502642 申请日期 2006.08.11
申请人 SANKEN ELECTRIC CO., LTD. 发明人 AOYAGI HIDEKAZU;OTSUKA KOJI;SATO MASAHIRO
分类号 H01L21/00;H01L33/00;H01L33/04;H01L33/14 主分类号 H01L21/00
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