发明名称 |
Side-emitting LED package and method of manufacturing the same |
摘要 |
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
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申请公布号 |
US2006273337(A1) |
申请公布日期 |
2006.12.07 |
申请号 |
US20060444402 |
申请日期 |
2006.06.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
HAN KYUNG T.;CHOI MYOUNG S.;LEE SEON G.;HAHM HUN J.;HAN SEONG Y.;SONG CHANG H.;PARK YOUNG S. |
分类号 |
H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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