| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plating method where more uniform plating can be applied to the object to be plated, and defects in plating can be remarkably reduced. <P>SOLUTION: At first, the object to be plated is wetted with a plating liquid, then, electric current is made zero for a prescribed time. Next, the electric current is applied to the object in the plating liquid and an electrode plate, so as to perform plating treatment. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
