| 摘要 |
PROBLEM TO BE SOLVED: To provide an effective method of manufacturing a substrate and an electronic component which is excellent in electrical reliability without executing an electroless plating process or the like. SOLUTION: Before an opening 28 formed in a base material 22 of an electronic component is filled with a conductive material, at first a groove 24b is formed to enclose an opening 24a of an upper conductor 24, and the upper conductor 24 is divided into a first conductive part 24c and a second conductive part 24d enclosing the first conductive part 24c. Thereafter, a mask 32 is formed so that a conductor 30 filling the opening 28 does not come into contact with the second conductive part 24d. Subsequently, metal plating is formed from a lower conductor 26 side of the opening 28 using the lower conductor 26 as an electrode, and the opening 28 is filled with metal plating. The metal plating filling the opening 28 and the upper conductor 24 are connected by plating using the upper conductor 24 or the lower conductor 26 as an electrode. COPYRIGHT: (C)2007,JPO&INPIT
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