| 摘要 |
A driver IC package capable of being used in a display device and a display device incorporating the driver IC package are presented. The driver IC package includes a base film, a signal pattern formed on a first side of the base film, an IC chip mounted on the base film and connected to the signal pattern, and a heat radiation pattern formed on a second side of the base film. The base film is located between the IC chip and the heat radiation pattern. The heat radiation pattern, which may be made of a thermally conductive material, helps dissipate the heat generated by the IC chip.
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