| 发明名称 |
Chip Package |
| 摘要 |
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.
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| 申请公布号 |
US2006273435(A1) |
申请公布日期 |
2006.12.07 |
| 申请号 |
US20060422337 |
申请日期 |
2006.06.06 |
| 申请人 |
LIN MOU-SHIUNG;LIN SHIH-HSIUNG;LO HSIN-JUNG |
发明人 |
LIN MOU-SHIUNG;LIN SHIH-HSIUNG;LO HSIN-JUNG |
| 分类号 |
H01L23/02;H01L23/04;H01L23/12;H01L23/48 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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