发明名称 Heat mold device and a method of making a guide wire by using the same heat mold device
摘要 In a heat mold device 1 for a guide wire 9 , the metallic mold body 2 is made from the material, the thermal expansional coefficient of which is the same of a metallic coild wire 91 to stabilize a shape-forming configuration 94 . A plurality of the mold bodies 2 are arranged in a mold frame 6 A to make the reverse side 22 of one mold body 2 tightly contact with the overse side 21 of other mold body 2 among the neighboring mold bodies 2 . A jig arm 7 A sandwiches an array of metallic mold bodies 2 and the side plate 63 to serve as a securement member 7 . Upon manufacturing the guide wire 9 well-suited to the medical field, the heat mold device 1 renders it possible to make a high quality guide wire with a high productivity.
申请公布号 US2006272751(A1) 申请公布日期 2006.12.07
申请号 US20060443487 申请日期 2006.05.31
申请人 ASAHI INTECC CO., LTD. 发明人 KATO TOMIHISA
分类号 C21D9/52;B21F99/00 主分类号 C21D9/52
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