发明名称 |
DEVELOPER-SOLUBLE MATERIALS AND METHODS OF USING THE SAME IN VIA-FIRST DUAL DAMASCENE APPLICATIONS |
摘要 |
Wet-recess (develop) gap-fill and bottom anti-reflective coatings based on a polyamic acid or polyester platform are provided. The polyamic acid platform allows imidization to form a polyimide when supplied with thermal energy. The gap-fill and bottom anti-reflective coatings are soluble in standard aqueous developers, and are useful for patterning via holes and trenches on semiconductor substrates in a dual damascene patterning scheme. In one embodiment, compositions composed of polyamic acids can be used as gap-filling (via-filling) materials having no anti-reflective function in a copper dual damascene process to improve iso-dense fill bias across different via arrays. In another embodiment, the same composition can be used for anti-reflective purposes, wherein the photoresist can be directly coated over the rescessed surface, while it also acts as a fill material to planarize via holes on the substrate. The compositions described here are particular suitable for use at exposure wavelengths of less than about 370 nm. |
申请公布号 |
WO2005038878(A3) |
申请公布日期 |
2006.12.07 |
申请号 |
WO2004US34495 |
申请日期 |
2004.10.15 |
申请人 |
BREWER SCIENCE INC.;BHAVE, MANDAR;WASHBURN, CARLTON, A.;PULIGADDA, RAMA;EDWARDS, KEVIN |
发明人 |
BHAVE, MANDAR;WASHBURN, CARLTON, A.;PULIGADDA, RAMA;EDWARDS, KEVIN |
分类号 |
G03F7/00;G03F7/004;G03F7/037;G03F7/11;G03F7/26;G03F7/30;G03F7/40;H01L;H01L21/31;H01L21/311;H01L21/4763 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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