发明名称 APPARATUS AND METHOD FOR ELECTRO-PLATING TO PARTS WITH CENTER HOLE
摘要 A device and a method for electroplating hollow parts which can electroplate the parts without a surface covering agent, obtain an uniform plating solution distribution by uniformly spraying a plating solution into the hollow parts, and constantly maintain a plating thickness per the respective parts to be plated even when plating the parts by flowing an electric current through parts to be plated that are arranged in series are provided. A device(100) for electroplating hollow parts comprises: a lower plate(110) of which an upper portion is airtightly connected to at least one hollow part(C), and in the center of which a spiral groove(114) and a through hole(112) for flowing a plating solution are formed; a propeller shaped turbulent inducer(120) formed on the spiral groove; an upper plate(130) which is installed at an upper side of the at least one hollow part, and has an inserting hole(132) formed in a central part thereof; an anode rod(140) which is movably inserted and clamped into the inserting hole of the upper plate and represents a positive electrode; and a cathode rod(150) which is connected to an outer side of the hollow part and represents a negative electrode.
申请公布号 KR100657653(B1) 申请公布日期 2006.12.07
申请号 KR20060022989 申请日期 2006.03.13
申请人 LEE, YE KUN 发明人 LEE, YE KUN
分类号 C25D17/02;C25D17/00 主分类号 C25D17/02
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