| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for plasma surface treatment which can execute large area/equalization processing by suppressing the influence of a standing wave being a problem factor in large area/equalization processing by high-frequency plasma. <P>SOLUTION: In the method and apparatus for plasma surface treatment, a plurality of power feeding points are arranged with an interval of quarter of a wavelength on the rear surfaces of non-ground electrodes, power to be output from a plurality of high-frequency power sources in relation of independence from each other is supplied to the plurality of power feeding points to generate a plurality of standing waves independent from each other, thereby equalizing power distribution between the electrodes. <P>COPYRIGHT: (C)2007,JPO&INPIT |
