| 摘要 |
PROBLEM TO BE SOLVED: To enable it to irradiate efficiently with ultraviolet rays the ultraviolet ray curing type masking tape currently stuck on the front surface at the time of rear surface grinding of a wafer, and to enable it to convey the wafer after ultraviolet-rays irradiation to a plasma etching device certainly. SOLUTION: A wafer conveyance device 4 for conveying a wafer W between a grinding device 2 for grinding the rear surface of the wafer W to which an ultraviolet curing tape is stuck on the surface and a plasma etching device 5 for carrying out plasma etching of the rear surface after grinding comprises a holder 40 for holding a wafer; and a support 41 for supporting the holder which makes the holder 40 move between the grinding device 2 and the plasma etching device 5. An ultraviolet-rays irradiator 43 is provided for irradiating ultraviolet rays to the curing tape stuck on the wafer in the move course of the holder 40. In this way, ultraviolet rays can be efficiently irradiated in the middle of movement. COPYRIGHT: (C)2007,JPO&INPIT
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