发明名称 Conditioning element for electrochemical mechanical processing
摘要 Embodiments of a conditioning element for conditioning a processing pad are provided herein. In one embodiment, a conditioning element for conditioning a processing pad includes a body having a face. A plurality of diamond particles are disposed on the face and define a conditioning surface. The diamond particles are of a type selected from the group consisting of very blocky ( 4 D), blocky ( 3 D), and irregular ( 2 D), and have a shape ratio less than or equal to 1.2. In one embodiment, the diamond particles have an average size of between about 85 and about 115 mum. In one embodiment, the size of the diamond particles may have a standard of deviation that is less than about 5 mum. In one embodiment, the diamond particles may have a spacing of greater than 400 mum.
申请公布号 US2006276111(A1) 申请公布日期 2006.12.07
申请号 US20050142918 申请日期 2005.06.02
申请人 APPLIED MATERIALS, INC. 发明人 TIAN YUAN A.;YILMAZ ALPAY;ALONZO GERALD J.;WOHLERT MARTIN S.;HU YONGQI;TSAI STAN D.;EWALD ROBERT A.;CHANG SHOU-SUNG
分类号 B24B1/00;B24B33/00 主分类号 B24B1/00
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