| 摘要 |
A method is provided for fabricating microelectrodes and microelectrode arrays by etching in an acid solution. Glass wafers are diced into a desired shape to form narrow probes, which are immersed in the acid solution. An organic layer on top of the acid solution forms a meniscus at the point of contact with the probes, and the taper angle on the etched probes will depend on this meniscus angle. After etching, the tapered probes are coated with a conductive layer, followed by an insulating layer over most of their length so as to leave a small conductive area exposed at the tip. The glass wafer containing the probes is then mounted on a printed circuit board carrier.
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