| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition which is excellent in the heat resistance and the adhesiveness on a circuit board used in the field of electronic materials and is applicable as a protecting layer and an adhesive for the board. SOLUTION: Provided is a fluorine-containing aromatic polymer composition containing an epoxy compound a fluorine-containing aromatic polymer, and an initiator. A fluorine-containing aryl ether polymer is preferably used for the fluorine-containing aromatic polymer. The initiator, particularly a cation initiator, is preferably used to cure the epoxy compound (epoxy resin). COPYRIGHT: (C)2007,JPO&INPIT |
