发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT, SEMICONDUCTOR MANUFACTURING SYSTEM AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment, a semiconductor manufacturing system and a substrate processing method, in which only a required amount of a substance, such as gas, liquid, or solid, which is directly or indirectly used for substrate processing, can be supplied, when required, and thereby reduction in size of supply equipment or transport equipment is realized. SOLUTION: The semiconductor manufacturing equipment 1 and the semiconductor manufacturing system are equipped with a buffer unit 4. The buffer unit 4 is temporarily store the substance, which is supplied from an external supply source 20 and is required for substrate processing, and supplies the stored substance to a processing chamber 2. The supply control of the substance is made by a CIM through a control unit 6 and a LAN 13. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006332700(A) 申请公布日期 2006.12.07
申请号 JP20060214971 申请日期 2006.08.07
申请人 TOSHIBA CORP 发明人 NAKAO TAKASHI;MIYAZAKI KUNIHIRO
分类号 H01L21/02 主分类号 H01L21/02
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