| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer transferring device having simplified constitution and mechanism capable of facilitating processing and assembly, capable of simplifying a manufacturing process and reducing a manufacturing cost by minimizing the use of precision components, and capable of making an interval between each finger adjustable by an adjustment of a cum. SOLUTION: A semiconductor wafer transferring device includes a guide member 33 connected to a ball screw 31 so as to be moved to both of the right and left sides by the rotation of the ball screw 31 rotated by a drive means with an inclined face formed on an outside face, a lever 40 that is brought into surface contact with the guide member 33 so as to enable a partial rotary drive with its center set as a reference by the inclined face, a center finger 27 connected to a connecting members 81, 82, 83, and 84 corresponding to and connected to a plurality of sliding members 61, 62, 63, and 64 that vertically slide on a guide shaft by a drive of the lever 40, and a plurality of drive fingers 90 that vertically and laterally move. COPYRIGHT: (C)2007,JPO&INPIT
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