| 摘要 |
PROBLEM TO BE SOLVED: To provide a measuring method of an etching rate based on an actual condition when forming a circuit more than before, and also to provide a manufacturing method of a printed wiring board using this measuring method of the etching rate. SOLUTION: After etching the end face T of a sample S for which metal layers M<SB>1</SB>and M<SB>2</SB>are formed on a substrate K, distances L<SB>1</SB>and L<SB>2</SB>from the end face T<SB>0</SB>of the substrate K to the end faces T<SB>1</SB>and T<SB>2</SB>of the etched metal layers M<SB>1</SB>and M<SB>2</SB>are measured, and the etching rate is obtained on the basis of the distances L<SB>1</SB>and L<SB>2</SB>. A manufacturing condition is set on the basis of at least the etching rate obtained by the etching rate measuring method, the metal layer is formed, and the printed wiring board is manufactured. COPYRIGHT: (C)2007,JPO&INPIT
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