| 摘要 |
PROBLEM TO BE SOLVED: To provide leadless solder paste which stabilizes the joining between a circuit board and a packaged electronic component or the like, to provide a soldering method, and to provide a method for stabilizing the joining of an electronic component. SOLUTION: The leadless solder paste composition comprises flux, Sn-Ag based solder alloy powder, and at least one kind of metal powder selected from Ag powder, Sn powder and Cu powder. The content of the metal powder is≤3 wt.% to the total of the Sn-Ag based solder alloy powder and the metal powder, and also, the average grain size of the metal powder is≤10μm. The soldering method and the method for stabilizing the joining of an electronic component use the paste composition. COPYRIGHT: (C)2007,JPO&INPIT
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