Memory module e.g. registered dual in-line memory module, has two groups of semiconductor chips connected by two separate line buses, respectively, where conducting paths of line buses branch out to all semiconductor chips of groups

摘要

The module has multiple semiconductor chips (1-9) mounted on an outer surface of a printed circuit board. A group of five semiconductor chips (1-5) is arranged between another group of four semiconductor chips (6-9) and a center of the circuit board. The two groups of the chips are connected by two separate line buses (L1, L2), respectively, where conducting paths of the buses branch out to all semiconductor chips of the groups.