CIRCUIT BOARD, METHOD FOR MANUFACTURING SUCH CIRCUIT BOARD, AND ELECTRONIC COMPONENT USING SUCH CIRCUIT BOARD

摘要

Provided are a circuit board having a high through hole sealing characteristic, a method for manufacturing such circuit board and an electronic component using such circuit board. The circuit board (1) includes an insulating substrate (10), and a through hole (11) formed in a thickness direction of the insulating substrate (10) for connecting a first main plane (10a) of the insulating substrate (10) with a second main plane (10b) of the insulating substrate (10). The circuit board (1) is characterized in that the board includes a conductive film (12) formed on an inner wall of the through hole (11) and on the circumference of an opening section of the through hole (11) on the first and the second main planes (10a, 10b), and a filling member (14) applied in the through hole (11), and that the filling member (14) is applied in a nonfoamed status.