| 摘要 |
PROBLEM TO BE SOLVED: To provide a solution-type adhesive composition capable of fixing a substrate such as a semiconductor wafer on a support evenly in a plane at an optional thickness, having strong and highly heat-resistant adhesion ability during processing of the wafer, and capable of easily separating the wafer from the support after the processing. SOLUTION: The solution-type adhesion composition comprises an adhesive component, a solvent, and if necessary an additive. The adhesive component has a melting temperature of 50-300°C, a melting temperature width of 30°C or less, and a melt viscosity at the melting temperature of 0.1 Pa s or less. The content of the adhesive component is 5-30 wt%. The composition has a solution viscosity at 25°C of 5-100 mPa s. COPYRIGHT: (C)2007,JPO&INPIT
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