| 摘要 |
<p>A mold for transfer molding which is used for molding a semiconductor package is provided. The transfer mold includes a port portion (12) through which a compound is supplied and rectangular center blocks (10) in which runners (14) extended from the port portion (12) are formed, both which are disposed at the center of a mold base (1), wherein a plurality of rectangular chases (20) in which runners (22) lengthily extended so as to communicate with the runners (14), and cavities (24) communicating with the runners (22) are formed, are aligned in the form of a cross to thereby abut on the four sides of the center block (10).</p> |
