| 摘要 |
<p>A semiconductor device manufacturing apparatus includes an upper die, a lower die, and a plate, which includes a cavity wherein a resin is injected and which specifies an outer shape and a thickness of a resin sealing section, and a gate for guiding the resin to the cavity, and is inserted between the upper die and the lower die. The plate further includes a resin film fixed by either cohesion or adhesion on a side which comes into contact with a substrate electrode. A semiconductor device having no resin burr generated on the substrate at an end plane portion of a molding can be provided. In the plate, pluralities of thin plates are bonded in layers by welding.</p> |
