发明名称 HEAT INSULATING PANEL CONCURRENTLY USED AS MOLD FORM
摘要 <p>A heat insulating panel concurrently used as a mold form, comprising a panel body (1) and a T-shaped bar (20) fitted to the upper surface thereof integrally with each other. An upper surface vertical slit (10) is formed in the upper surface of the panel body (1) through its overall length, and a plurality of locking projected bars (11) are integrally and projectedly fitted in the slit at intervals in the longitudinal direction. The T-shaped bar (20) comprises a connection portion (21) and a pair of insertion portions (22) and (23). The lower insertion portion (23) is inserted into the upper surface vertical slit (10) of the panel body (1), and locked by the projected bars (11) to prevent the lower insertion portion from being coming out. Thus, the heat insulating panel concurrently used as the mold form having the pane body and the T-shaped bar can be rapidly and easily manufactured and its production cost can be remarkably reduced.</p>
申请公布号 WO2006129395(A1) 申请公布日期 2006.12.07
申请号 WO2005JP22625 申请日期 2005.12.09
申请人 HIZAKI CONSTRUCTION CO., LTD.;HIZAKI, SHUICHI;HAMAKI, YUKIHIRO;NAKAJIMA, TOSHINORI 发明人 HIZAKI, SHUICHI;HAMAKI, YUKIHIRO;NAKAJIMA, TOSHINORI
分类号 E04B2/86 主分类号 E04B2/86
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