PCB AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a method for manufacturing the same are provided to improve a radiation effect by using an insulation bump having high thermal conductivity. A method for manufacturing a printed circuit board includes the steps of: forming a core layer which stacks an insulation layer on both planes of a conductive layer(S21); stacking the core layer and an insulation bump between metallic plates so that the insulation bump penetrates the conductive layer(S22); and forming a circuit pattern by removing the metallic plate, and forming a via hole which electrically connects the circuit pattern(S23). After the step(S23), the method further includes the step of stacking two printed circuit boards which are separated by a bump substrate between the two printed circuit boards.