发明名称 |
METHOD FOR MANUFACTURING PHOTOMASK, EXPOSURE METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a photomask and an exposure method taking into consideration the influence of aberration. <P>SOLUTION: A shifter film 52 to control the transmittance and the phase angle of transmitting exposure light is formed on a transparent substrate 51 made of quartz or the like. The material of the shifter film 52 is, for example, MoSiO, MoSiON, CrO and CrON. A resist film 53 is used as a mask to etch the shifter film 52 by reactive ion etching using CF<SB>4</SB>+O<SB>2</SB>gas for MoSiO and MoSION or using Cl<SB>2</SB>CO<SB>2</SB>gas for CrO and CrON to form a light transmitting portion 852 corresponding to an auxiliary measurement pattern. Then the resist film 53 is removed to complete the photomask 50. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2006330760(A) |
申请公布日期 |
2006.12.07 |
申请号 |
JP20060220044 |
申请日期 |
2006.08.11 |
申请人 |
RENESAS TECHNOLOGY CORP |
发明人 |
NARIMATSU KOICHIRO;YAMASHITA SHIGENORI;YOSHIOKA NOBUYUKI;SOEDA SHINYA;HACHISUGA ATSUSHI;TANIGUCHI KOJI;MIYAMOTO YUKI;SAITO TAKAYUKI;MINAMIDE AYUMI |
分类号 |
G03F1/26;G03F1/29;G03F1/42;G03F1/68;G03F9/00;H01L21/027 |
主分类号 |
G03F1/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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