| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce leakage of electromagnetic wave noise, from not only the laminated upper face or the lower face of a semiconductor chip, but also from the sides. <P>SOLUTION: The whole semiconductor chip 7, which is phase-up-mounted on a carrier substrate 1, is sealed by electromagnetic wave shielding resin 9 arranged on the carrier substrate 1 so that it covers a bonding wire 8. The semiconductor chip 11 is mounted phase-up on the semiconductor chip 7. The semiconductor chip 11 is sealed by sealing resin 13, arranged on the carrier substrate 1 so that it covers a bonding wire 12. <P>COPYRIGHT: (C)2007,JPO&INPIT |
