发明名称 HARDENING RESIN COMPOSITE FOR SEALING LED, AND LED PACKAGE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a hardening resin composite for sealing LEDs which provides a hardening material that is thermally hardened in a short time, has an excellent transparency and hardly changes into yellow, and thereby attains an LED package suppressed with a decline in emission luminance over time; and also to provide the LED package using the same. <P>SOLUTION: The hardening resin composite for sealing LEDs contains (A) a resin having an alicyclic structure and an ethylene unsaturated group and (B) an organic peroxide, and has at least 80% of light transmission in a wavelength region of 350-700 nm of a thermally hardening material (thickness of 1 mm). A light emitting element with the main emission peak of 550 nm or less is coated with this resin composite, and then the resin composite is thermally hardened at 100-180&deg;C to fabricate the LED package. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006332262(A) 申请公布日期 2006.12.07
申请号 JP20050152655 申请日期 2005.05.25
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 NISHIGUCHI SHOJI;YAGINUMA DAISUKE;KAMATA HIROTOSHI
分类号 H01L33/50;C08F290/00;H01L23/29;H01L23/31;H01L33/56 主分类号 H01L33/50
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