| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit device which contributes to downsizing and improvement of connection reliability. <P>SOLUTION: The method for manufacturing a circuit device is provided with processes of: forming first isolation grooves 36A from the surface of conductive foil 30 so that a first conductive pattern 13 and a second conductive pattern 14 may be protruded, and forming a second isolation groove 36B from the surface of the conductive foil 30 in its part to be bent; electrically connecting a first device 11 for detecting a physical quantity with the first conductive pattern 13, and connecting a second device 12 with the second conductive pattern 14; bending the conductive foil 30 at the point where the second isolation groove 36B is formed; forming a sealing resin 15 in such a way that it covers the two devices and fills the first isolation grooves 36A and the second isolation groove 36B; and removing the conductive foil 30 from its underside until the sealing resin 15 is exposed as filling the first isolation grooves 36A and the second isolation groove 36B. <P>COPYRIGHT: (C)2007,JPO&INPIT |
