SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent generation of failure in drying of a substrate in a substrate processing apparatus and a substrate processing method for picking up the substrate from a processing liquid and drying it after dipping the substrate into the processing liquid. SOLUTION: A first nozzle 41 and a gas discharge section 43 are arranged oppositely to each other in a horizontal direction with the substrate W exposed to the upper part of the processing liquid sandwiched. A dry gas is jetted to the substrate W in substantially parallel from the first nozzle 41 to the gas discharge section 43 near the surface level of the processing liquid. The dry gas is jetted to the substrate W from a slanting upper part from a second nozzle 42 arranged immediately above the first nozzle 41 toward a region R1 where the dry gas to be jetted from the first nozzle 41 moves around to the upper part of a substrate holding guide 35. Thus, the dry gas is sufficiently supplied even to a blocking region BR shaded by the substrate holding guide 35 when only a gas stream from the first nozzle 41 is jetted. COPYRIGHT: (C)2007,JPO&INPIT