| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable high density soldering method in which a space for replacing an electronic component mounted on a printed wiring board is not required, and to provide a highly reliable printed wiring board for mounting an electronic component formed by that soldering method. SOLUTION: Solder holding flux 13 is applied to the surface of a land 12 formed on a printed wiring board 11, and a solder 14 molded in the same shape as that of the land 12 is fixed onto the solder holding flux 13 by sticking. Furthermore, electronic component holding flux 15 is applied thereon, a BGA semiconductor device is fixed and heated beyond the melting point of solder, and then it is cooled thus soldering the semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT
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