发明名称 |
INSULATING THERMALLY-CONDUCTIVE RESIN COMPOSITION, MOLDED PRODUCT, AND METHOD FOR PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an insulating thermally-conductive resin composition from which a molded product having high insulating properties and thermal conductivity is obtainable and which is excellent in moldability, to provide the molded product, and to provide a method for producing the same. SOLUTION: This insulating thermally-conductive resin composition comprises at least a thermoplastic resin, water-resistant magnesium oxide, a metal powder having a melting point of≥500°C, and a low-melting alloy having a melting point of≤500°C. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006328155(A) |
申请公布日期 |
2006.12.07 |
申请号 |
JP20050151242 |
申请日期 |
2005.05.24 |
申请人 |
IDEMITSU KOSAN CO LTD;NIPPON KAGAKU YAKIN CO LTD |
发明人 |
KOSAKA WATARU;HARANO TAKUJI;INADA YOSHIKAZU |
分类号 |
C08L101/00;C08K3/08;C08K3/22;H01B3/00 |
主分类号 |
C08L101/00 |
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