| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for a coverlay, free from halogen, excellent in resistance to migration, flame retardancy, and peeling strength, and used in a flexible printed circuit board, and to provide the flexible printed circuit board given by using the same. SOLUTION: This halogen-free adhesive composition is used for the coverlay of the flexible printed circuit board, wherein the adhesive composition for the coverlay contains an elastomer (A), a thermosetting component (B), a metal hydroxide, (D) a curing agent, and (E) a silicone oligomer. The elastomer (A) preferably has one or more functional groups reactive with a thermosetting resin of the thermosetting component (B). Further, a surface of the metal hydroxide (C) is preferably treated with the silicone oligomer (E). COPYRIGHT: (C)2007,JPO&INPIT
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