| 摘要 |
<p>A glass penetrating wiring board required for an LSI testing device having tens of thousands of contact terminals and a packaging element such as MEMS used with a moving part air sealed, and a production method thereof. First, as shown in (a), recessed grooves are formed in a glass substrate (11) and conductor wires (12) are buried there, next, as shown in (b), conductor wire(12)-buried glass substrates (11) are bonded using fluorinated acid, HF, etc. And, as shown in (c), bonded glass substrates are sliced and then sliced surfaces are polished to thereby complete a glass penetrating wiring board (14).</p> |
