| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent damage on a lower component during laser trimming on an upper component of a substrate layer. <P>SOLUTION: A substrate layer 12 includes a first principle surface 16 and a second principle surface (lower surface). Conductive first layers 22, 24 and 26 cover the first principle surface and conductive second layers 20 and 34 cover the second principle surface. The first layer has a first pattern including a trimmable portion 24 and the second layer has a second pattern including the first conductive element 34 matching with at least a part of the trimmable portion. The pattern of the second layer includes the second conductive element 20 electrically separated from the first conductive element 34, and the second conductive element surrounds the first conductive element. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
