发明名称 HONEYCOMB STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a honeycomb structure which has excellent adhesive strength, in which the thermal expansion of a honeycomb member caused by thermal stress can be absorbed in all directions and which has excellent resistance to thermal shock. SOLUTION: The honeycomb structure is constituted such that a plurality of honeycomb members, in each of which a great number of cells are arranged in parallel across cell walls in the longitudinal direction and each of which has an outer edge wall at the outer edge, are stuck to one another via adhesive material layers. The adhesive material layer contains an inorganic fiber and an inorganic binder at the least. A part of the inorganic fiber has 6-100μm fiber diameter. The orientation degreeΩof the inorganic fibers determined according to the method of Saltykov is 0.2≤Ω≤0.7 or -0.7≤Ω≤-0.2 when the longitudinal direction of the inorganic fibers is regarded as an oriented axis. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006326574(A) 申请公布日期 2006.12.07
申请号 JP20060034345 申请日期 2006.02.10
申请人 IBIDEN CO LTD 发明人 NINOMIYA TAKESHI;IMAEDA MASAKI
分类号 B01J35/04;B01D39/14;B01D39/20;B01D46/00;B32B3/12;B32B9/00;C04B37/00 主分类号 B01J35/04
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