| 摘要 |
A method of manufacturing a LIGA mold by backside exposure includes the steps of: disposing a mask layer at a side of a first substrate, wherein the first substrate is transparent to a predetermined light source and has a front side and a backside; forming a photoresist layer on the front side of the first substrate; providing the predetermined light source to illuminate the backside of the first substrate so as to expose the photoresist layer to form an exposed portion and an unexposed portion; removing the unexposed portion to form a patterned structure on the photoresist layer; forming a metal layer on the patterned structure of the photoresist layer and the first substrate; and removing the photoresist layer and the first substrate to remain the metal layer as the LIGA mold, which is good in a de-molding procedure of a hot embossing process.
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