SOLDER JOINTS FOR COPPER METALLIZATION HAVING REDUCED INTERFACIAL VOIDS

摘要

A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 µm in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 µm in their main crystal direction. A body (102) of tin alloy is in contact with the bond pad.