| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method of a polishing pad and the polishing pad where the rising time of the polishing speed after changing the polishing pad is short, and the life of the polishing pad is long. <P>SOLUTION: Polishing liquid and the polishing pad are used in the continuous manufacturing method of a substrate. The polishing pad is processed by a preparatory polishing using the polishing liquid A where a supernatant layer of the waste polishing liquid by a standard test becomes 8 to 60 vol.% of the entire waste polishing liquid. Next, the continuous polishing of the substrate is performed by the main polishing using the polishing liquid B where the supernatant layer of the waste polishing liquid by the standard test becomes 0.01 to 5 vol.% of the entire waste polishing liquid. <P>COPYRIGHT: (C)2007,JPO&INPIT |
