| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable electronic device suppressing heat transmitted from a heater unit 3 to an electronic component 5 without causing malfunction due to thermal rupture or change of characteristics by heat in the electronic component 5. SOLUTION: The electronic device is provided with: a substrate 1 with electronic components 5 mounted thereon; a metallic layer 2, formed on the surface of the substrate 1 so as to surround the mounted part of the electronic components 5 and a lid body 4 is connected thereto; and the heater unit 3 provided on the substrate 1 so as to oppose to the metallic layer 2. A site 9, having a heat conductivity lower than those of the other sites of the substrate 1, is formed in a heat transmitting route from the heater unit 3 of the substrate 1 to the mounting unit. COPYRIGHT: (C)2007,JPO&INPIT |
