SOLID-STATE IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a solid-state imaging device having durability in which the junction between a rib and a transparent plate to be joined to the upper end surface of the rib is improved against a stress applied to the rib and the plate due to thermal deformation.

SOLUTION: The solid-state imaging device is provided with: a casing 1 obtained by integrally forming a substrate section 2 and the rectangular frame-like rib 3 with a resin; a plurality of metallic lead pieces 9 buried in the casing and each having an inner terminal portion 9a facing the internal space of the casing and an external terminal portion 9b exposed to the outside of the casing; an imaging element 5 fixed on the substrate in the internal space of the casing; metallic fine wires 10 each connecting an electrode of the imaging element to the internal terminal portion of a metallic lead piece; and a translucent plate 7 joined to the upper end surface of the rib. A low level portion lower along the external periphery is formed on the upper end surface of the rib, and an adhesive also exists on one part of the side face of the translucent plate by an adhesive material filled on at least the low level portion.

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