| 摘要 |
PROBLEM TO BE SOLVED: To develop a device and a method for inspecting a wafer whereby color information and high-resolution structural information are obtained at a low cost. SOLUTION: The device for inspecting a wafer includes: illuminating means for illuminating a wafer surface; image-forming means which includes at least one camera having an image-forming range and optically forms an image on the wafer surface; moving means for relative movements between the image-forming range and the wafer surface; and evaluating means for evaluating the wafer. The image-forming means includes two cameras focused in the same image-forming range. By using such a device, the wafer surface is illuminated, an image is formed in the image-forming range by means of the first camera, an image is formed in the same image-forming range of the wafer by means of the second camera having a different resolution, the wafer surface covered with the image-forming range is changed, and the camera images are evaluated. COPYRIGHT: (C)2007,JPO&INPIT
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