发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board with built-in parts which can be easily manufactured and scarcely leaves solvent and air bubbles in an insulating layer and is excellent in strength, and to provide a method of efficiently manufacturing the printed wiring board with built-in parts. SOLUTION: In the printed wiring board in which parts are built, a part or all of the insulating layer constituting the printed wiring board consists of an insulating material including fiber which is not spun or woven and a resin composition, and relates to the method of manufacturing the printed wiring board. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006332578(A) 申请公布日期 2006.12.07
申请号 JP20050287998 申请日期 2005.09.30
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI HIRONORI;KUMAKURA YOSHITOSHI
分类号 H05K1/03 主分类号 H05K1/03
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