| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method suitable for inspecting the quality of a solid imaging device by quantitatively detecting a plane defect deprived of connecting shots in the surface of a single solid imaging device. SOLUTION: The inspection method for inspecting a solid imaging device detects a defect of image quality by detecting the output change of pixels of a solid imaging device. In the two or more pixels located in a straight linear shape and in order along a rectilinear direction, the inspection method comprises an output value detection process for detecting an every output value of a respective pixel unit or a respective predetermined number of pixels, and an output difference operation process for computing the output difference between an output value and an output value detected just before this output value. COPYRIGHT: (C)2007,JPO&INPIT
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