| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for mounting a high-frequency circuit device that prevents the leakage of high-frequency signals to the outside, reduces the number of part items as well as the number of steps for fitting parts, downsizes a mounting case, is thinned, and secures area and space necessary for a circuit substrate while needing no severe manufacturing accuracy for a case side or the like or a connector itself. SOLUTION: In the structure for mounting a high-frequency power amplifier wherein a substrate 43 is pinched by a heat sink 51 and a case 46, a space constriction groove (tunnel) 55 is provided to allow the coaxial cable of connectors 47 and 48 to pass through the inside of the bottomless case 46 having a ceiling, so as to prevent the leakage of high-frequency signals to the outside from the input/output part of high-frequency signals. The connectors 47 and 48 are secured to the column 57 for fitting connectors that is fitted in the heat sink 51, and the column 57 is formed in a shape to cover a notch 52 in the input/output part of high-frequency signals that is formed in the case 46. COPYRIGHT: (C)2007,JPO&INPIT
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