| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition which is free from a halogen compound and has high heat resistance, and to provide a prepreg, a laminate and a printed circuit board which each uses the resin composition. SOLUTION: This halogen element-free resin composition comprises a resin material and aluminum hydroxide containing particles having diameters of≤0.5μm in an amount of≤0.2%, having a BET specific surface area of≤1.5 m<SP>2</SP>/g, and having an average particle diameter of 1.0 to 5.0μm. The resin material is preferably an epoxy resin not containing a halogen element, and the content of the aluminum hydroxide is preferably 50 to 150 wt.% based on the resin content. COPYRIGHT: (C)2007,JPO&INPIT
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