发明名称 SOLDER MATERIAL WIRE FOR SOLDERING ALUMINUM ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a solder material wire at low cost, which solder material wire is excellent in machinability, and can solder an aluminum alloy casting product at a soldering temperature of 530 to 560°C. SOLUTION: A hollow sheath 1 made of an Al-Si alloy is filled with a Cu wire material 2 together with fluoride-based non-corrosive flux powder 3 containing cesium fluoride. When the sheath is made of an Al-Si alloy plate containing 5 to 15 mass% of Si, and the Cu wire material supplied in the sheath has become an Al-Cu-Si ternary alloy by being alloyed with the sheath material, it is preferable that the Cu wire material has a diameter corresponding to that containing 22 to 37 mass% of Cu in the ternary alloy. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006326621(A) 申请公布日期 2006.12.07
申请号 JP20050152002 申请日期 2005.05.25
申请人 NIPPON LIGHT METAL CO LTD 发明人 OKI YOSHITO;EBIHARA TAKESHI;KURAMASU YUKIO
分类号 B23K35/28;B23K35/363;C22C21/00 主分类号 B23K35/28
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